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8 haenau PCB

8 haenau PCB

hdi_pcb_mobile_phone_pcb_of_8layer_with_immersion_gold

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hdi_pcb_mobile_phone_pcb_of_8layer_with_immersion_gold

EitemauDatas technegol
haenauHaen 1-12
Deunyddiau sylfaenCEM 3, FR-4alwminiwm, CEM-1, 22F, FR-1
Trwch Bwrdd0.3 mm-3.20 mm (12mil-126mil)
Trwch Bwrdd craidd gofynnol0.1mm(4mil)
Trwch copr1/2 owns min; 3 owns uchafswm.
Isafswm lled/llinellau0.1mm(4mil)
Diamedr twll gofynnol0.25mm(10mil)
Twll PTH goddefgarwch0.9mm(35mil)
GoddefgarwchSafle twll±0.075mm(3mil)
Lled llinell±0.1 mm (4mil) neu % ±20 lled llinell
Maint y twllPTH±0.1mm(4mil)
NPTH±0.075mm(3mil)
Goddefgarwch allanolNeuadd machine±0.15MM(6mil)
Pwnsh peiriant ±0.10mm(4mil)
Twist a oes arall0.70%-1%
Mae'r arwyneb yn gorffenAer blatio/Entek/poeth nicel/aur a lefelu
inswleiddio ymwrthedd10KΩ-20MΩ
dargludiad ymwrthedd< 50Ω
Profion foltedd300V
Toriad VMaint y Panel110×100mm(min.) 660×600mm(max.)
Trwch Bwrddmin 0.6 mm (24mil).
Trwch sy'n weddillmin 0.3 mm (12mil).
Goddefgarwch±0.1mm(4mil)
slot o led0.50 mm (20mil) uchafswm.
Slot amser lled10mm min.
Amser i linellmunud 0.50 mm (20mil).
Slot wedi'iSlot maint tol. > = goddefgarwch 2WPTH L:±0.15mm(6mil)
W:±0.1mm(4mil)
NPTH L:±0.125mm(5mil)
W:±0.1mm(4mil)
Goddefgarwch cofrestru gofynnol twllPTH Hole:0.13mm(5mil)
NPTH Hole:0.18(7mil)
Cofrestru dim goddefgarwch o flaen/yn ôl delweddGoddefgarwch cofrestru gofynnol patrwm0.075mm(3mil)
multilayerInterlayer goddefgarwchHaen 4: 0.15 mm (6mil) uchafswm.
haenau: 0.025 6 mm (10mil) uchafswm.
Pellter gofynnol rhwng twll a roundness mewnol0.25mm(10mil)
Ymyl Bwrdd isafswm pellter a roundness mewnol0.25mm(10mil)
Goddefiant trwch Bwrdd4 layers:±0.13mm(5mil)
6 layers:±0.15mm(6mil)
rhwystrol naturiol60% yn ohm±10

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